Description
SIPLACE CA2: High-speed chip assembly directly from wafer and SMT placement in one machine
System in Package (SiP), Advanced Packaging, Chip Assembly, Wafer Level SiP, Flip Chip, Wafer feeder, Die bonding, High accuracy SMT placement
ASMPT-PlacementSolutions-SIPLACE-CA2-1
Additional information
| Picture/Graphics | Picture |
|---|---|
| Filter | SMT machine single without operator |
