Description
Two machines – one line
The SIPLACE TX micron and the SIPLACE CA2 can be set up on the same production line, which brings several advantages for the manufacturer: Simpler intralogistics, lower costs, more environmentally friendly and more efficient processes.
SIPLACE CA2: High-speed chip assembly directly from wafer and SMT placement in one machine
System in Package (SiP), Advanced Packaging, Chip Assembly, Wafer Level SiP, Flip Chip, Wafer feeder, Die bonding, High accuracy SMT placement
SIPLACE TX micron: A milestone for advanced packaging and high-density applications.
SIPLACE TX micron, Placement Platform, Placement System, SMT line
